WinLink Samsung Exynos 850 Mobile processor, MYD- Y7Z010_ 20- V2 Development Board, Platform Cable USB II, Discovery kit with STM32MP157F MPU, Discovery kit with STM32F769NI MCU, Discovery kit with STM32H573IIK3Q MCU
Kolkata, West Bengal, India
Important Dates
Bid submission started
Aug. 15, 2024, 1:20 a.m.
Bid submission ended
Sept. 25, 2024, 12:30 a.m.
Price Information
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Tender Description:
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Tender Type:
open
Dates:
Published on
Aug. 15, 2024, 1:20 a.m.
Bid Opening Date
Sept. 5, 2024, 2 a.m.
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