Tender Description:
Providing and laying 230 mm dia GSW line in place of 200/150 mm GSW line and construction & reconstruction of machineholes at Doddachanappa layout Ramachandrapura and surrounding areas coming under Singapura S/stn of AEEN-2-2 sub division
Dates:
Published on
Sept. 21, 2024, 6:27 p.m.
Bid Opening Date
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