Diamond impregnated wafering blade 5 inch outer dia X, 0. 015 inch thickness X 0. 5 inch central hole, Q3, Diamond, impregnated wafering blades 6 inch outer dia X 0. 020 inch, thickness X 0. 5 inch central hole, impregnated wafering blades 7 inch outer dia X 0. 025 inch
Hyderabad, Telangana, India
Important Dates
Bid submission started
March 8, 2024, 1:17 a.m.
Bid submission ended
March 28, 2024, 3:30 p.m.
Price Information
Price
19.47 Lacs
EMD
38.94 Thousands
Tender Description:
None
Tender Type:
open
Dates:
Published on
March 8, 2024, 1:17 a.m.
Bid Opening Date
March 28, 2024, 4 p.m.
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