Tender Description:
MMIC DIE TR MMIC Die fabrication and packaging and at least 2 nos. qualification as per specification mentioned in Request for Proposal(RFP) MMICS Quad TR Unit including COTS Attenuator, Phase Shifter as mentioned in Request for Proposal(RFP) MMIC PACKAGE Test setup for Frequency of operation including Jig, RF cables, Power Supply, 1x4 Microstrip Patch Antennas, 1x4 Power Divider/Combiner and Accessories as mentioned in Request for Proposal(RFP)
Dates:
Published on
Sept. 20, 2024, 5:30 p.m.
Bid Opening Date
Nov. 4, 2024, 8 p.m.
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