Tender Description:
ASIC FABRICATION: Fabrication of ASICs in MPW mode in vendor proposed 28nm CMOS process with die area of 6 mm2 as per RFP No: Doc No. HSTA/TEC/3/23-05 ASIC FABRICATION: Additional fabrication cost for per mm2 of chip area for vendor proposed 28nm CMOS process as per RFP No: Doc No. HSTA/TEC/3/23-05 ASIC FABRICATION: Assembly and packaging of 20 Nos of dies per MPW run in CQFP 208L package as per RFP No: Doc No. HSTA/TEC/3/23-05 ASIC FABRICATION: Assembly and packaging of 20 Nos of dies per MPW run in CQFP 100L package as per RFP No: Doc No. HSTA/TEC/3/23-05
Dates:
Published on
Sept. 17, 2024, 10 p.m.
Bid Opening Date
Oct. 14, 2024, 6:30 p.m.
Doc Download started
Unknown
Doc Download ended
Unknown